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Surface Roughness Reduction For Improving Bonding in U/C Rapid Manufacturing

Today digitally-driven or additive manufacturing methodologies have become increasingly significant. The current market has grown to over $1 billion, and is projected to reach $2.3 billion in annual sales worldwide by 2012.The future promises competitive usage of these methodologies for prototyping, tooling, and end-use purposes. To address these changing needs, a researcher at Utah State University has developed a method of surface roughness reduction for improving bonding in ultrasonic consolidation (UC) rapid manufacturing. Advantages of reducing surface roughness include an increase in percentage and quality of the material contact between each layers, as well as improved bonding between the first and subsequent material layers, resulting in higher strength, and better performing end-products.
Features and Benefits
  • Rapid manufacturing processes to make components for:
    • Military
    • Aerospace
    • Diagnostics and sensor technologies
    • Microsystems
  • Reduces labor-intensive conventional machining, resulting in training and labor costs savings
  • Programmed fabrication layer-by-layer minimizes defects, and reduces scrap and rework time
  • Improves part quality, reliability and integrity
The new USU technology enhances the bonding linear weld density along the interface of material layers deposited through a UC manufacturing process. The process steps include depositing and bonding a first material layer, then reducing the surface roughness of the contact surface to prepare it for receiving a subsequent material layer.
Development Stage
Prototypes exist to continue testing and optimization for various applications.
US Patent Application Publication No. 2007/0295440
Glenn Whichard
Senior Commercialization Associate
Physical Sciences
(435) 797-9604
Reference: W06036